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NTB5426N, NTP5426N,
NVB5426N
Power MOSFET
120 Amps, 60 Volts
N-Channel D 2 PAK, TO-220
Features
? Low R DS(on)
? High Current Capability
? Avalanche Energy Specified
? AEC Q101 Qualified ? NVB5426N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Power Supplies
? Converters
? Power Motor Controls
? Bridge Circuits
V (BR)DSS
60 V
http://onsemi.com
R DS(ON) MAX
6.0 m W @ 10 V
N ? Channel
D
G
I D MAX
(Note 1)
120 A
MAXIMUM RATINGS (T J = 25 ° C Unless otherwise specified)
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Symbol
V DSS
V GS
Value
60
$ 20
Unit
V
V
4
S
Gate ? to ? Source Voltage ? Nonrepetitive
(T P < 10 m s)
Continuous Drain Steady T C = 25 ° C
Current R q JC State
(Note 1) T C = 100 ° C
V GS
I D
30
120
85
V
A
TO ? 220AB
1
2
3
D 2 PAK
4
Power Dissipation
R q JC (Note 1)
Steady
State
T C = 25 ° C
P D
215
W
1
2
3
CASE 221A
STYLE 5
CASE 418B
STYLE 2
Pulsed Drain Current
t p = 10 m s
I DM
260
A
MARKING DIAGRAMS
Operating and Storage Temperature Range
Source Current (Body Diode)
T J , T stg
I S
? 55 to
+175
60
° C
A
4
Drain
& PIN ASSIGNMENTS
4
Drain
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 50 V dc , V GS = 10 V dc , I L(pk) = 70 A,
L = 0.3 mH, R G = 25 W )
Lead Temperature for Soldering
Purposes, 1/8 ″ from Case for 10 Seconds
THERMAL RESISTANCE RATINGS
E AS
T L
735
260
mJ
° C
5426N
AYWW
1
Gate
3
Source
1
Gate
5426N
AYWW
2
Drain
3
Source
Parameter
Symbol
Max
Unit
2
Junction ? to ? Case (Drain)
Steady State (Note 1)
R q JC
0.7
° C/W
Drain
G
= Pb ? Free Device
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [1 oz] including traces).
A = Assembly Location
Y = Year
WW = Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 1
1
Publication Order Number:
NTB5426N/D
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